2022-09-18 15:13 Status: # Wafers Start with a top of molten silicon - starting seed crystal you dip into the silicon and slowly pull out as you rotate it. This creates an [ingot](ingot.md) ![](attachments/Pasted%20image%2020220918151805.png#invert) Then- take a thin slice of ingot to create wafers. ![](attachments/Pasted%20image%2020220918151821.png#invert) ## Zone Purification Need to purify the ingot first. Place in an RF field (coil - high current creates [eddy currents](eddy%20currents.md) in the ingot). This melts a small section of the silicon. ![](attachments/Pasted%20image%2020220918151855.png#invert) Moving the molten zone up tends to concentrate impurities, so you can 'filter'them out by moving this zone along the ingot. ![](attachments/Pasted%20image%2020220918152021.png#invert) ## Common Sizing ~10-30cm ![](attachments/Pasted%20image%2020220918152101.png#invert) ## Types of Wafer ### P-type Normal disc (not often: use [n-type](n-type.md)) ### Epi-wafer Low doped on top then high doped below. ![](attachments/Pasted%20image%2020220921101148.png#invert) Heavy doping prevents latch up - not good for transistors though. Downside - can't have separate analogue and digital ground.[^1] ### Insulator on top(typically SO2), then p-type. ![](attachments/Pasted%20image%2020220921101558.png#invert) Lower parasitics means a faster device - need to add silicon on top to manufacture transistors. --- # References [^1]: [vr-4602-wk01-sc02-wafers](../../Spaces/University/ELEC4602%20–%20Microelectronics%20Design%20and%20Technology/Lectures/W1/vr-4602-wk01-sc02-wafers.mp4)