2022-09-18 15:13
Status:
# Wafers
Start with a top of molten silicon - starting seed crystal you dip into the silicon and slowly pull out as you rotate it.
This creates an [ingot](ingot.md) 
Then- take a thin slice of ingot to create wafers.

## Zone Purification
Need to purify the ingot first.
Place in an RF field (coil - high current creates [eddy currents](eddy%20currents.md) in the ingot).
This melts a small section of the silicon.

Moving the molten zone up tends to concentrate impurities, so you can 'filter'them out by moving this zone along the ingot.

## Common Sizing
~10-30cm

## Types of Wafer
### P-type
Normal disc (not often: use [n-type](n-type.md))
### Epi-wafer
Low doped on top then high doped below.

Heavy doping prevents latch up - not good for transistors though.
Downside - can't have separate analogue and digital ground.[^1]
###
Insulator on top(typically SO2), then p-type.

Lower parasitics means a faster device - need to add silicon on top to manufacture transistors.
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# References
[^1]: [vr-4602-wk01-sc02-wafers](../../Spaces/University/ELEC4602%20–%20Microelectronics%20Design%20and%20Technology/Lectures/W1/vr-4602-wk01-sc02-wafers.mp4)